Electronic paper module, electronic paper display device and manufacturing method of electronic paper

ABSTRACT

An electronic paper module, an electronic paper display device and a manufacturing method of an electronic paper module are disclosed, and the electronic paper module including an array substrate and an electronic ink containing layer, a transparent sealant, a transparent conductive film layer and a protective layer disposed in order on the array substrate, the electronic ink containing layer is provided with electronic ink containing holes therein, the electronic ink containing holes are provided with electronic ink therein. The transparent sealant is used to encapsulate the electronic ink containing layer, and the transparent conductive film layer is disposed over the transparent sealant. Because no microcapsule structure is required in the electronic paper module, a process flow is simplified, and production costs are effectively reduced.

TECHNICAL FIELD

Embodiments of the present invention relate to an electronic papermodule, an electronic paper display device and a manufacturing method ofthe electronic paper module.

BACKGROUND

Electronic paper is a technology that realizes black-white or colordisplay by driving electronic ink with an array substrate. Due to itsadvantages of extremely low power consumption and suitability for humaneye reading, electronic paper has been drawing attention of people.Electronic paper typically realizes display by means of micro-cuptechnology or micro-capsule technology. Whatever electronic paperdisplay technology is used, display of text information requiresdriving. Array substrates generally adopt active matrix driving. Forexample, the thin film transistor (TFT) technology is one of thetechnologies for realizing active matrix driving. Of course, besides theactive matrix driving, passive driving technologies may also be used todrive electronic paper display.

FIG. 1 is a structural representation of an electronic paper modulebased on electronic ink micro-capsule technology in a black-whitedisplay state. The electronic paper module includes in order an arraysubstrate 10, an electronic paper film 8 and an upper substrate 6, andan adhesive layer 9 is provided between the electronic paper film 8 andthe array substrate 10 for affixing the electronic paper film 8 to thearray substrate 10. The electronic paper film 8 includes a layer oftransparent film and micro-capsules disposed therein. A micro-capsuleincludes a capsule wall 3 and electronic ink contained therein. Theelectronic ink includes white particles 1, black particles 4, andtransparent electrophoresis liquid 2. The capsule wall 3 encapsulatesthe electronic ink to form a micro-capsule. A transparent conductivefilm 7 is disposed between the upper substrate and the electronic paperfilm 8. In general, a PET (polyethylene terephthalate) plate is used asthe upper substrate 6; and further, a protective film 5 may be disposedon the upper substrate for further protecting the electronic papermodule.

As illustrated in FIG. 2, in manufacturing of the above-mentionedelectronic paper module, typically white particles and black particlesfor display are dispersed into a transparent electrophoresis liquid andencapsulated by a capsule wall to form micro-capsules. Themicro-capsules are bonded to a transparent film by an adhesive agent toform an electronic paper film, and this electronic paper film isdisposed on an array substrate via an adhesive layer. Thereafter, theupper substrate provided with a transparent conductive film (such as ITOfilm) is attached onto the electronic paper film. Then the protectivefilm is attached to the upper substrate to form the electronic papermodule.

However, the above-mentioned process for manufacturing electronic paperbased on micro-capsule technology is complicated and requires complexoperations illustrated in FIG. 2: making an electronic paper film andthen attaching the film to an array substrate, further attaching theupper substrate, and finally encapsulating. This results in high costsand reduces competitive power.

SUMMARY

Embodiments of the present invention provide an electronic paper module,an electronic paper display device and a manufacturing method of theelectronic paper module that can simplify the technical process andreduce the costs.

One aspect of the present invention provides an electronic paper modulecomprising an array substrate and an electronic ink containing layer, atransparent sealant, a transparent conductive film layer and aprotective layer disposed in order on the array substrate, theelectronic ink containing layer is provided with electronic inkcontaining holes therein, the electronic ink containing holes areprovided with electronic ink therein, the transparent sealant isconfigured to encapsulate the electronic ink containing layer, and thetransparent conductive film layer is disposed over the transparentsealant.

For example, in the electronic paper module, the electronic inkcontaining layer may be a resin layer.

For example, in the electronic paper module, pixel electrodes may bedisposed between the array substrate and the electronic ink containinglayer.

For example, in the electronic paper module, the electronic inkcontaining holes may be disposed over the pixel electrodes.

For example, in the electronic paper module, a number of the electronicink containing holes may be one or more than one; and/or a cross-sectionof the electronic ink containing holes may be circle or rectangle.

For example, in the electronic paper module, the electronic inkcontaining holes may be disposed perpendicularly to the electronic inkcontaining layer.

For example, in the electronic paper module, the electronic inkcontaining holes may be through holes or blind holes.

For example, in the electronic paper module, where the electronic inkcontaining holes are through holes, a protective layer is providedbetween the electronic ink containing layer and the array substrate, ora protective layer is provided between the electronic ink containingholes and the array substrate; where the electronic ink containing holesare blind holes, blind ends of the electronic ink containing holes facethe array substrate.

Another aspect of the present invention provides an electronic paperdisplay device including the above-mentioned electronic paper module.

Yet another aspect of the present invention provides a manufacturingmethod of an electronic paper module comprising:

S11, forming an electronic ink containing layer on an array substrate;

S12, forming electronic ink containing holes in the electronic inkcontaining layer;

S13, providing electronic ink in the electronic ink containing holes;

S14, encapsulating the electronic ink containing layer formed with theelectronic ink containing holes with a transparent sealant;

S15, forming patterns including a transparent conductive film layer onthe transparent sealant; and

S16, forming a protective film on the transparent conductive film layer.

For example, in the method, before step S11, a step of forming the arraysubstrate may be included, and the array substrate has pixel electrodesformed thereon.

For example, in the method, the step S12 may be: forming the electronicink containing holes in portions of the electronic ink containing layerthat correspond to pixel electrodes on the array substrate.

For example, in the method, the electronic ink containing layer may be aresin layer.

For example, in the method, step S12 may be: forming the electronic inkcontaining holes in the resin layer by a patterning process.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to clearly illustrate the technical solution of the embodimentsof the invention, the drawings of the embodiments will be brieflydescribed in the following; it is obvious that the described drawingsare only related to some embodiments of the invention and thus are notlimitative of the invention.

FIG. 1 is a structure diagram of a conventional electronic paper module;

FIG. 2 is a manufacturing flow chart of the conventional electronicpaper module;

FIG. 3 is a manufacturing flow chart of an electronic paper moduleaccording to an embodiment of the present invention;

FIG. 4 is a structure diagram of an electronic paper module according toan embodiment of the present invention;

FIG. 5 is a top view of an electronic ink containing layer according toan embodiment of the present invention.

REFERENCE NUMERALS

1. White particle; 2. Transparent electrophoresis liquid; 3. Capsulewall; 4. Black particle; 5. Protective film; 6. Upper substrate; 7.Transparent conductive film; 8. Transparent film; 9. Adhesive layer; 10.Array substrate; 11. Electronic ink containing layer; 12. Transparentsealant; 13. Electronic ink containing hole.

DETAILED DESCRIPTION

In order to make objects, technical details and advantages of theembodiments of the invention apparent, the technical solutions of theembodiments will be described in a clearly and fully understandable wayin connection with the drawings related to the embodiments of theinvention. Apparently, the described embodiments are just a part but notall of the embodiments of the invention. Based on the describedembodiments herein, those skilled in the art can obtain otherembodiment(s), without any inventive work, which should be within thescope of the invention.

Unless otherwise defined, all the technical and scientific terms usedherein have the same meanings as commonly understood by one of ordinaryskill in the art to which the present invention belongs. The terms“first,” “second,” etc., which are used in the description and theclaims of the present application for invention, are not intended toindicate any sequence, amount or importance, but distinguish variouscomponents. Also, the terms such as “a,” “an,” “the” and the like arenot intended to limit the amount, but indicate the existence of at leaseone. The terms “comprises,” “comprising,” “includes,” “including,” and“contains”, “containing” etc., are intended to specify that the elementsor the objects stated before these terms encompass the elements or theobjects and equivalents thereof listed after these terms, but do notpreclude the other elements or objects. The phrases “connect”,“connected”, etc., are not intended to define a physical connection ormechanical connection, but may include an electrical connection,directly or indirectly. “On,” “under,” “right,” “left” and the like areonly used to indicate relative position relationship, and when theposition of the object which is described is changed, the relativeposition relationship may be changed accordingly.

FIG. 4 is a structure diagram of an electronic paper module according toan embodiment of the present invention; FIG. 5 is a top view of anelectronic ink containing layer according to an embodiment of thepresent invention. For example, FIG. 4 is a sectional view along lineA-A′ in FIG. 5.

As illustrated in FIG. 4, the electronic paper module provided in theembodiment of the present invention includes an array substrate 10 andan electronic ink containing layer 11, a transparent sealant 12, atransparent conductive film layer 7 and a protective layer 5 disposed inthis order on the array substrate 10. The electronic ink containinglayer 11 is provided with electronic ink containing holes 13 therein, inwhich electronic ink (EI) is provided, the transparent sealant 12 isadapted to encapsulate the electronic ink containing layer 11, and thetransparent conductive film layer 7 is disposed (for example directlydisposed) over the transparent sealant 12. Referring to the embodimentillustrated in FIG. 5, the array substrate 10 includes a plurality ofpixel units arranged in an array.

As illustrated in FIG. 4, the electronic ink EI may include whiteparticles 1, transparent electrophoresis liquid 2, black particles 4 torealize black-white display of the electronic paper module. It is to beunderstood that it is also possible to change the transparentelectrophoresis liquid to a colorful electrophoresis liquid (by addingdyes and/or pigments), or substitute color particles for black and whiteparticles, so as to realize color display of electronic paper, whichwill not be described in detail here.

The electronic ink containing layer 11 may be a resin layer with athickness of for example 5˜15 μm.

The array substrate may adopt an active driving or passive drivingmethod, for example, the thin film transistor (TFT) driving technologyin the active matrix driving technologies.

Whatever driving technology the array substrate adopts, pixel electrodes14 are required between the array substrate and the electronic inkcontaining layer. A voltage is formed between the pixel electrodes 14and the transparent conductive film 7 serving as common electrodes todrive black and white particles to move in the vertical direction of thearray substrate and realize black-white display. The principle forelectronic paper to realize black-white display or color display is wellknown in the art, which will not be repeated here. The pixel electrodes14 are disposed corresponding to pixel units.

For example, the electronic ink containing holes 13 are formed over thepixel electrodes 14. For example, each electronic ink containing hole 13corresponds to one pixel electrode 14, or a plurality of electronic inkcontaining holes 13 correspond to one pixel electrode 14.

In the electronic paper module according to an embodiment of the presentinvention, for example, the number of the electronic ink containingholes 13 may be one or more than one, and the cross-section may be in ashape of circle, rectangle, equiangular triangle, regular hexagon, whichis not limited thereto in the present invention. The electronic inkcontaining holes 13 may be disposed perpendicularly to the electronicink containing layer 11. The electronic ink containing holes 13 may bethrough holes or blind holes. When the electronic ink containing holes13 are through holes, it is required to dispose a protective layer (notshown) between the electronic ink containing layer 11 and the arraysubstrate 10 or dispose a protective layer (not shown) between theelectronic ink containing holes 13 and the array substrate 10, it isenough for the protective layer to ensure that the performance ofelectronic ink and the array substrate are both not influenced. When theelectronic ink containing holes 13 are blind holes, the blind ends ofthe electronic ink containing holes 13 may face the array substrate 10,as illustrated in FIG. 4. In general, the depth of electronic inkcontaining holes 13 is equivalent to the thickness of electronic inkcontaining layer 11; and the cross-sectional area of an electronic inkcontaining hole 13 may vary with a different size of the electronicpaper display screen, and is generally slightly smaller than an area ofone pixel.

One embodiment of the present invention may be as illustrated in FIG. 5.In FIG. 5, square electronic ink containing holes 13 are providedperpendicular to the electronic ink containing layer 11, and whiteparticles 1 and black particles 4 are contained in the electronic inkcontaining holes 13 to realize normal black-white display.

An embodiment of the present invention further provides an electronicpaper display device including the above-mentioned electronic papermodule.

The electronic paper module in the embodiment of the present inventionhas no micro-capsule structure, an electronic ink containing layer 11may be formed directly on the array substrate 10 to contain electronicink by means of electronic ink containing holes 13 therein, andtherefore the process flow is simplified, production efficiency isimproved, and production costs are effectively reduced. In addition, theelectronic paper module needs no upper substrate (for example PET plate)6, which further saves costs and enables it to become slighter andthinner. Furthermore, with the electronic paper display device includingthe electronic paper module according to an embodiment of the presentinvention, the process flow is also simplified, the productionefficiency is improved and the production costs are effectively reduced,and costs may be further saved and it may become slighter and thinnersince the upper substrate 6 is not needed.

Another embodiment of the present invention provides a manufacturingmethod of electronic paper module, including the following steps:

S11. Forming an electronic ink containing layer on an array substrate.

The forming method in this step may be deposition, coating, sputteringand thermal evaporation, which is not limited here.

S12. Forming electronic ink containing holes in the electronic inkcontaining layer.

The forming method in this step may be any suitable process selectedaccording to the material of electronic ink layer.

S13. Providing electronic ink in the electronic ink containing holes.

The electronic ink may be provided in the electronic ink containingholes by means of dropping, spraying or the like in this step. Theelectronic ink may be prepared separately or prepared in situ and thenprovided into the electronic ink containing holes.

S14. Encapsulating the electronic ink containing layer formed with theelectronic ink containing holes with a transparent sealant.

For example, the material for the transparent sealant in this step ismainly epoxy resin. Since transmission of incident light and reflectedlight is necessary for realizing display, the sealant must betransparent.

S15. Forming patterns including a transparent conductive film layer onthe transparent sealant.

The transparent conductive film layer may be indium tin oxide (ITO) andindium zinc oxide (IZO), and the forming methods may be deposition,sputtering, thermal evaporation or the like.

S16. Forming a protective film on the transparent conductive film layer.

Any existing available material may be used for the protective film,which will not be described here.

Furthermore, before step S11, a step of forming an array substrate maybe included, and the array substrate has pixel electrodes formedthereon.

For example, one example of step S12 is: forming electronic inkcontaining holes in portions of the electronic ink containing layer thatcorrespond to pixel electrodes on the array substrate.

If the electronic ink containing layer in the above-mentionedmanufacturing method is a resin layer, electronic ink containing holesmay be formed in the resin layer by a patterning process.

In the present disclosure, the patterning process may include onlyphotolithographic process, or may include photolithographic process andetching step, also may further include processes for formingpredetermined patterns such as printing, ink jetting or the like asrequired. The photolithographic process refers to the process forforming patterns with photoresist, mask and exposure machine, includingtechnical processes such as film formation, exposure and development. Acorresponding patterning process may be selected depending on thestructure formed in the present invention.

It is known in connection with FIGS. 3 and 4, the electronic inkcontaining layer 11 of a resin material may be deposited on the arraysubstrate 10 and electronic ink containing holes 13 for containingelectronic ink are formed by a patterning process in the electronic inkcontaining layer 11. After dropping electronic ink into the electronicink containing holes 13, the electronic ink containing layer 11 formedwith the electronic ink containing holes 13 is encapsulated with thetransparent sealant 12. Then a transparent conducting layer such astransparent ITO film layer is deposited over the transparent sealant 12,and next a protective film 5 is attached on the transparent conductinglayer to complete the electronic paper module.

As can be seen, in manufacturing of the electronic paper module in anembodiment of the present invention, no micro-capsule structures aremanufactured, an electronic ink containing layer 11 is formed directlyon the array substrate 10 to contain electronic ink by means ofelectronic ink containing holes 13 therein, and therefore process flowis simplified, production efficiency is improved, and production costsare effectively reduced. In addition, no upper substrate (for example aPET plate) 6 is manufactured, which further saves costs and enables itto become slighter and thinner.

The electronic paper module and the electronic paper display device inthe embodiments of the present invention have no micro-capsulestructures, an electronic ink containing layer is deposited directly onthe array substrate to contain electronic ink by means of electronic inkcontaining holes therein in manufacturing of the electronic papermodule, therefore process flow is simplified, production efficiency isimproved, and production costs are effectively reduced. In addition, theupper substrate commonly used in the conventional technology is notneeded, which further saves costs and enables it to become slighter andthinner.

What are described above is related to the illustrative embodiments ofthe disclosure only and not limitative to the scope of the disclosure;the scopes of the disclosure are defined by the accompanying claims.

1. An electronic paper module comprising an array substrate and anelectronic ink containing layer, a transparent sealant, a transparentconductive film layer and a protective layer disposed in order on thearray substrate, wherein the electronic ink containing layer is providedwith electronic ink containing holes therein, the electronic inkcontaining holes are provided with electronic ink therein, thetransparent sealant is configured to encapsulate the electronic inkcontaining layer and the transparent conductive film layer is disposedover the transparent sealant.
 2. The electronic paper module of claim 1,wherein the electronic ink containing layer is a resin layer.
 3. Theelectronic paper module of claim 1, wherein pixel electrodes aredisposed between the array substrate and the electronic ink containinglayer.
 4. The electronic paper module of claim 3, wherein the electronicink containing holes are disposed over the pixel electrodes.
 5. Theelectronic paper module of claim 1, wherein a number of the electronicink containing holes is one or more than one; and/or a cross-section ofthe electronic ink containing holes is circle or rectangle.
 6. Theelectronic paper module of claim 1, wherein the electronic inkcontaining holes are disposed perpendicularly to the electronic inkcontaining layer.
 7. The electronic paper module of claim 1 wherein theelectronic ink containing holes are through holes or blind holes.
 8. Theelectronic paper module of claim 7, wherein where the electronic inkcontaining holes are through holes, a protective layer is providedbetween the electronic ink containing layer and the array substrate, ora protective layer is provided between the electronic ink containingholes and the array substrate; wherein the electronic ink containingholes are blind holes, blind ends of the electronic ink containing holesface the array substrate.
 9. An electronic paper display devicecomprising the electronic paper module of claim
 1. 10. A manufacturingmethod of an electronic paper module comprising: S11, forming anelectronic ink containing layer on an array substrate; S12, formingelectronic ink containing holes in the electronic ink containing layer;S13, providing electronic ink in the electronic ink containing holes;S14, encapsulating the electronic ink containing layer formed with theelectronic ink containing holes with a transparent sealant; S15, formingpatterns including a transparent conductive film layer on thetransparent sealant; and S16, forming a protective film on thetransparent conductive film layer.
 11. The method of claim 10, furthercomprising, before step S11, a step of forming the array substratehaving pixel electrodes formed thereon.
 12. The method of claim 10,wherein step S12 comprises: forming the electronic ink containing holesin portions of the electronic ink containing layer that correspond topixel electrodes on the array substrate.
 13. The method of claim 10,wherein the electronic ink containing layer is a resin layer.
 14. Themethod of claim 13, wherein step S12 is forming the electronic inkcontaining holes in the resin layer by a patterning process.
 15. Theelectronic paper module of claim 3, wherein the electronic inkcontaining holes are disposed perpendicularly to the electronic inkcontaining layer.
 16. The electronic paper module of claim 3, whereinthe electronic ink containing holes are through holes or blind holes.17. The electronic paper module of claim 16, wherein where theelectronic ink containing holes are through holes, a protective layer isprovided between the electronic ink containing layer and the arraysubstrate, or a protective layer is provided between the electronic inkcontaining holes and the array substrate; wherein the electronic inkcontaining holes are blind holes, blind ends of the electronic inkcontaining holes face the array substrate.
 18. The electronic papermodule of claim 4, wherein the electronic ink containing holes aredisposed perpendicularly to the electronic ink containing layer.
 19. Theelectronic paper module of claim 4, wherein the electronic inkcontaining holes are through holes or blind holes.
 20. The electronicpaper module of claim 19, wherein where the electronic ink containingholes are through holes, a protective layer is provided between theelectronic ink containing layer and the array substrate, or a protectivelayer is provided between the electronic ink containing holes and thearray substrate; wherein the electronic ink containing holes are blindholes, blind ends of the electronic ink containing holes face the arraysubstrate.